The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Feb. 23, 2016
Applicant:
Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;
Inventors:
Takaaki Hioka, Chiba, JP;
Mika Ebihara, Chiba, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01); G01R 33/00 (2006.01); G01R 33/07 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); G01R 33/0052 (2013.01); G01R 33/07 (2013.01); H01L 43/065 (2013.01); H01L 43/14 (2013.01);
Abstract
A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the recessed portion is fitted in the recessed portion of the magnetic converging plate holder.