The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Sep. 14, 2015
Applicant:

Kookmin University Industry Academy Cooperation Foundation, Seoul, KR;

Inventors:

Hyunjung Lee, Seoul, KR;

Yongmyeong Kim, Daegu, KR;

Hyunwoo Bark, Seoul, KR;

Woohyung Choi, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); H01L 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/30 (2013.01);
Abstract

Provided is a thermoelectric module apparatus including: a pipe-shaped housing having a hole that is longitudinally formed; a thermoelectric module coupled to the housing; and heat sinks combined with the thermoelectric module, in which the pipe-shaped housing has a plurality of mount holes having predetermined width and length, longitudinally extending, and arranged circumferentially in parallel with each other, the thermoelectric module has a plurality of thermoelectric plates having predetermined width, length, and thickness, the housing is connected to first sides in the width direction of the thermoelectric plates, the thermoelectric plates are disposed in the mount holes respectively with a portion in the width direction inserted and exposed inside the hole as much as a predetermined width and a portion in the width direction protruding and exposed outside the housing as much as a predetermined width, and the heat sinks are connected to the portions exposed outside the housing.


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