The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Apr. 12, 2016
Applicant:

Pixart Imaging Inc., Hsin-Chu, TW;

Inventors:

Chi-Chih Shen, Hsin-Chu, TW;

Yen-Hsin Chen, Hsin-Chu, TW;

Yi-Chang Chang, Hsin-Chu, TW;

Assignee:

PIXART IMAGING INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/14 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/143 (2013.01); H01L 31/1876 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/10155 (2013.01);
Abstract

A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.


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