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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9741742 B1

PDFFull Text
Date of Patent:
Aug. 22, 2017

Filed:

Dec. 22, 2015

Deformable electronic device and methods of providing and using deformable electronic device

Applicants:

Joseph Smith, Tempe, AZ (US);

Emmett Howard, Tempe, AZ (US);

Jennifer Blain Christen, Chandler, AZ (US);

Inventors:

Joseph Smith, Tempe, AZ (US);

Emmett Howard, Tempe, AZ (US);

Jennifer Blain Christen, Chandler, AZ (US);

Assignee:

Arizona Board of Regents, a body corporate of the State of Arizona, acting for and on behalf of Arizona State University, Scottsdale, AZ (US);

Attorney:

Bryan Cave LLP

Primary Examiner:

Thinh T Nguyen

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 27/12 (2006.01); H01L 21/306 (2006.01); H01L 29/786 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 27/146 (2006.01); H01L 27/15 (2006.01); H01L 23/31 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1218 (2013.01); H01L 21/30604 (2013.01); H01L 21/6835 (2013.01); H01L 21/768 (2013.01); H01L 23/3192 (2013.01); H01L 23/4985 (2013.01); H01L 27/1262 (2013.01); H01L 27/14636 (2013.01); H01L 27/153 (2013.01); H01L 29/78603 (2013.01); A61B 2562/02 (2013.01); A61B 2562/164 (2013.01); H01L 23/15 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.

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