The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Mar. 23, 2016
Applicant:
Kyocera Circuit Solutions, Inc., Kyoto, JP;
Inventors:
Hiroki Matsuwaka, Satsumasendai, JP;
Hisayoshi Wada, Kyoto, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 2224/81 (2013.01);
Abstract
A wiring board includes an insulating substrate having a plurality of laminated insulating layers and a mounting part in one surface of the insulating substrate, a large number of semiconductor element connection pads, a large number of external connection pads, and a solid pattern extending from a region corresponding to the mounting part to the peripheral portion of the insulating substrate, and including a straight line shaped current path without intervention of gas vent openings.