The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Jun. 02, 2016
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jian Xu, Wuhan, CN;
Abstract
A semiconductor package can include a semiconductor chip on a substrate inside the semiconductor package and an electrode pad spaced apart from the semiconductor chip on the substrate inside the semiconductor package. A wire can be inside the semiconductor package, to connect the electrode pad to the semiconductor chip and a barrier member can be on the substrate fencing-in the semiconductor chip, where the electrode pad and the wire can be in an interior portion of the substrate. A sealing material can be in the interior portion of the substrate fenced-in by the barrier member, where the sealing material covering the semiconductor chip, the electrode pad, and the wire.