The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Mar. 06, 2009
Applicants:
Martin Feldtkeller, Munich, DE;
Uwe Wahl, Munich, DE;
Inventors:
Martin Feldtkeller, Munich, DE;
Uwe Wahl, Munich, DE;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/762 (2006.01); H01L 23/50 (2006.01); H01L 27/06 (2006.01); H01L 31/153 (2006.01); H01L 23/00 (2006.01); H01L 21/8238 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 23/50 (2013.01); H01L 24/24 (2013.01); H01L 27/0623 (2013.01); H01L 31/153 (2013.01); H01L 21/823878 (2013.01); H01L 23/495 (2013.01); H01L 23/5227 (2013.01); H01L 27/08 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
Semiconductor component comprising at least two semiconductor regions are disclosed. In one embodiment the semiconductor regions of the semiconductor component are electrically isolated from one another by an insulator, and a deposited, patterned, metallic layer extends over the semiconductor regions and over the insulator.