The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Feb. 22, 2016
Applicant:

Bruker Eas Gmbh, Hanau, DE;

Inventors:

Manfred Thoener, Biebergemuend, DE;

Bernd Sailer, Alzenau, DE;

Assignee:

Bruker EAS GmbH, Hanau, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/02 (2006.01); H01L 39/24 (2006.01); H01B 13/14 (2006.01);
U.S. Cl.
CPC ...
H01B 12/02 (2013.01); H01B 13/14 (2013.01); H01L 39/2409 (2013.01);
Abstract

A semifinished wire () for a superconducting wire containing Nb3Sn has a Cu stabilization cladding tube (), a ring-shaped closed diffusion barrier () in the inside of the Cu stabilization cladding tube () and a plurality of PIT elements () in the inside of the diffusion barrier (), each having a cladding () containing Cu, a small tube (), and a powder core () containing Sn. The small tube () consists of Nb or an alloy containing Nb and the diffusion barrier () has a percentage of area ADF in cross-section of the semifinished wire () of 3% ADF 9% and a wall thickness WDF with 8 μm≦WDF≦25 μm. A plurality of filler elements () are arranged inside the diffusion barrier (), with the inner sides of the filler elements () abutting the PIT elements ().


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