The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Feb. 02, 2016
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Noritsugu Ozaki, Yokohama, JP;

Shunji Baba, Yokohama, JP;

Takayoshi Matsumura, Yokohama, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/07 (2006.01); H01Q 1/22 (2006.01); H01Q 7/00 (2006.01); H01Q 9/06 (2006.01); H01Q 9/28 (2006.01); G06K 19/02 (2006.01); G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/0723 (2013.01); G06K 19/022 (2013.01); G06K 19/07786 (2013.01); H01Q 1/2208 (2013.01); H01Q 7/00 (2013.01); H01Q 9/065 (2013.01); H01Q 9/285 (2013.01);
Abstract

An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.


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