The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9740908 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 22, 2017

Filed:

Nov. 09, 2015
Applicant:

Contek Life Science Co., Ltd., Taipei, TW;

Inventors:

Chein-Hsun Wang, Hsin-Chu, TW;

Yen Ju Lo, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06F 21/32 (2013.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); G06F 21/32 (2013.01); G06K 9/0002 (2013.01); G06K 9/00053 (2013.01);
Abstract

A capacitive fingerprint sensor includes a plate, a frame, a capacitive fingerprint sensor chip and a package body. The plate comprises a first surface, an opposite second surface and a plurality of first conductive pads arranged on the first surface. A plurality of second conductive pads and third conductive pads are respectively arranged on opposite surfaces of the frame, wherein the second conductive pads are electrically connected with the corresponding first conductive pads and third conductive pads. The capacitive fingerprint sensor chip is disposed at the central area of the frame by a flip chip manner and electrically connected with the first conductive pads. The package body is filled in the central area of the frame to cover the chip. The above-mentioned sensor has a flat sensing surface with wear resistance and better ESD toleration. A package method of the above-mentioned sensor is also disclosed.


Find Patent Forward Citations

Loading…