The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Nov. 13, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Qin Yuan, Poughquag, NY (US);

Mark Chace, Beacon, NY (US);

Jun Liu, Irvington, NY (US);

Janine L. Protzman, Poughkeepsie, NY (US);

Victoria L. Calero diaz del castillo, Fishkill, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/037 (2006.01); G03F 7/038 (2006.01); G03F 7/20 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); G03F 7/20 (2013.01); H01L 21/02118 (2013.01); H01L 21/02318 (2013.01); H01L 21/02348 (2013.01); H01L 23/293 (2013.01); H01L 23/3171 (2013.01);
Abstract

A formulation comprising an esterified polyamide resin with a photosensitive linkage, a polymerizable crosslinker, and an organic species is provided. The organic species is selected such that (a) when exposed to UV radiation, it copolymerizes with the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin forming the crosslinking network, (b) during thermal cure the copolymer thus formed drops from polyimide backbones, and (c) wherein the thermal degradation temperature of the copolymer thus formed is lower than the thermal degradation temperature of the homopolymer formed from the polymerizable crosslinker and the thermal degradation temperature of the copolymer formed from the polymerizable crosslinker and the photosensitive linkage on the esterified polyamide resin. The formulation is useful in forming a semiconductor passivation layer and facilitates more complete removal of crosslinker using less stringent conditions.


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