The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Aug. 27, 2013
Applicant:
Sharp Kabushiki Kaisha, Osaka, JP;
Inventor:
Keiji Aota, Osaka, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); C09J 9/02 (2006.01); H01L 21/50 (2006.01); H01L 21/603 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); C09J 9/02 (2013.01); H01L 21/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2021/603 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/81913 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83912 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/12042 (2013.01);
Abstract
In a display device, in which an IC chip, which has an output and an input bump group, is mounted onto a display panel via an ACF, and a total area of end surfaces of output bumps that form the output bump group is larger than a total area of end surfaces of input bumps that form the input bump group, a concentration of conductive particles in a portion of the ACF corresponding to the output bump group is lower than a concentration of conductive particles in a portion of the ACF corresponding to the input bump group.