The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

May. 13, 2013
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Fumiyoshi Ariki, Komaki, JP;

Minekazu Sakai, Kariya, JP;

Kiyomasa Sugimoto, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/18 (2013.01); G01P 15/02 (2013.01); G01P 15/125 (2006.01); G01C 19/5733 (2012.01); G01C 19/5769 (2012.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); G01C 19/5733 (2013.01); G01C 19/5769 (2013.01); G01P 15/18 (2013.01);
Abstract

A sensor device includes a semiconductor substrate and multiple sensing portions that are placed on one side of the semiconductor substrate and convert a physical quantity into an electrical signal. The one side is parallel to a reference plane defined by an X-direction and a Y-direction perpendicular to each other. The semiconductor substrate has a center point that is both a geometric center and a center of mass. The semiconductor substrate is axisymmetric with respect to each of a first reference line passing through the center point and parallel to the X-direction and a second reference line passing through the center point and parallel to the Y-direction. Each of the sensing portions is axisymmetric with respect to each of the first reference line and the second reference line.


Find Patent Forward Citations

Loading…