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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9739175 B1

PDFFull Text
Date of Patent:
Aug. 22, 2017

Filed:

Oct. 18, 2013

Molded part

Applicants:

Ihi Corporation, Tokyo, JP;

Ihi Aerospace Co., Ltd., Tokyo, JP;

Inventors:

Takashi Harada, Tokyo, JP;

Yu Shigenari, Tokyo, JP;

Koichi Inagaki, Tokyo, JP;

Agamu Tanaka, Tokyo, JP;

Tadahiro Ishigure, Tokyo, JP;

Assignees:

IHI Corporation, Tokyo, JP;

IHI AEROSPACE CO., LTD., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Dwayne J White

Assistant Examiner:

Aaron R Eastman

Int. Cl.
CPC ...
F01D 25/24 (2006.01); F01D 9/02 (2006.01); F02K 3/06 (2006.01); B29C 65/56 (2006.01); B29C 65/00 (2006.01); B29L 31/00 (2006.01); F16B 5/02 (2006.01);
U.S. Cl.
CPC ...
F01D 25/243 (2013.01); B29C 65/562 (2013.01); B29C 66/1312 (2013.01); B29C 66/543 (2013.01); B29C 66/721 (2013.01); F01D 9/02 (2013.01); F02K 3/06 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/73921 (2013.01); B29C 66/73941 (2013.01); B29L 2031/7504 (2013.01); F05D 2300/603 (2013.01); F16B 5/02 (2013.01); Y02T 50/672 (2013.01);
Abstract

An additional padis additionally and integrally arranged from an outer surface of a flangeopposite to a contacting side of the flangeto a small-diameter curved surface of a bendand from there to an end of an outer surface of a part body. On an outer surface side of the additional pad, a fastening seatis formed by machining. An area end PAe of a processed area PA formed by machining is positioned on the part bodybeyond the bend

Find Patent Forward Citations

Harada, Takashi. (2017). Molded part (U.S. Patent No. 9739175). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9739175

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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