The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
May. 21, 2013
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Yasuki Aoi, Gifu, JP;
Mayumi Ozeki, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, Aichi-pref., JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 89/00 (2006.01); C08L 89/06 (2006.01);
U.S. Cl.
CPC ...
C08L 89/00 (2013.01); C08L 89/06 (2013.01);
Abstract
A plastic molding composition includes a powder, gelatin, a polar solvent, and an adhesion reducer. The powder contains at least one of a ceramic particle and a metal particle. The adhesion reducer reduces adhesion of the gelatin so that a molded product, which is molded from the composition with a molding die, is removed from the molding die without being broken. The adhesion reducer is a water-soluble or water-dispersible compound. The adhesion reducer has a HLB value, calculated by Griffin's method, ranging from 10 to 20.