The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Sep. 26, 2011
Mami Hayashi, Iyo-gun, JP;
Takayuki Fujiwara, Iyo-gun, JP;
Jun Misumi, Iyo-gun, JP;
Kenichi Yoshioka, Iyo-gun, JP;
Mami Hayashi, Iyo-gun, JP;
Takayuki Fujiwara, Iyo-gun, JP;
Jun Misumi, Iyo-gun, JP;
Kenichi Yoshioka, Iyo-gun, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
Abstract
An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.