The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

May. 30, 2014
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Yoichi Shimba, Otsu, JP;

Kazuyuki Matsumura, Otsu, JP;

Toshihisa Nonaka, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08K 5/07 (2006.01); B29C 41/02 (2006.01); C08K 9/04 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); C08K 3/00 (2006.01); H05K 3/30 (2006.01); H01L 23/495 (2006.01); B29K 63/00 (2006.01); B29K 105/16 (2006.01); B29K 509/00 (2006.01); H01L 21/603 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29C 41/02 (2013.01); C08K 3/0033 (2013.01); C08K 5/07 (2013.01); C08K 9/04 (2013.01); H01L 21/50 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); B29K 2063/00 (2013.01); B29K 2105/16 (2013.01); B29K 2509/00 (2013.01); C08J 2363/00 (2013.01); H01L 23/49558 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2021/603 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81204 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/3512 (2013.01); H05K 3/305 (2013.01);
Abstract

Provided is a resin sheet, wherein in a stress measurement in which a dynamic shear strain is applied in a direction parallel to a surface, the difference between a loss tangent as measured when a strain amplitude is 10% of the sheet thickness and a loss tangent as measured when the amplitude is 0.1% is equal to or greater than 1 at a temperature of 80° C. and a frequency of 0.5 Hz. The resin sheet of the present invention can provide a semiconductor device with excellent connection reliability, wherein air bubbles and cracks are less likely to occur in the resin sheet. In the resin composition of the present invention, aggregates are less likely to occur during storage. The resin sheet obtained by forming the resin composition into a sheet has good flatness. The hardened material thereof can provide a circuit board or a semiconductor device with high connection reliability.


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