The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Dec. 21, 2011
Mitsuo Takai, Mori-machi, JP;
Mitsuo Takai, Mori-machi, JP;
CAP CO., LTD., Shuuchi-gun, Shizuoka, JP;
Abstract
A molding device which can heat molding portions of dies by a simple structure while guaranteeing the durability of the molding portions of the dies, and a method of molding a product using the molding device are provided. A molding deviceincludes a first dieand a second diefor molding a product PR to be molded. The first dieand the second diehave a first molding portionand a second molding portionformed at central portions of the surfaces which face each other. Each of the first molding portionand the second molding portionhas a three-dimensional shape corresponding to the surface shape of the product PR. Thermal/electrical insulatorsandare provided around the first molding portionand the second molding portionof the first dieand the second die. An electrical power supply apparatusis connected to the first dieand the second diethrough input/output electrodesand, and the first dieand the second diecan be electrically connected together through connection electrodesandand electrically disconnected from each other.