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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9738012 B1

PDFFull Text
Date of Patent:
Aug. 22, 2017

Filed:

Aug. 15, 2014

Mold component

Applicant:

Husky Injection Molding Systems Ltd., Bolton, CA;

Inventors:

Adam Christopher Ulemek, Mississauga, CA;

Maxfield Paul Bradshaw, Oakville, CA;

Sami Samuel Arsan, Mississauga, CA;

Renato Papa, Scarborough, CA;

Daniel Joseph Osmokrovic, Toronto, CA;

Assignee:

HUSKY INJECTION MOLDING SYSTEMS LTD., Bolton, Ontario, CA;

Attorney:
Primary Examiner:

James Sanders

Int. Cl.
CPC ...
B29C 33/04 (2006.01); B29C 45/73 (2006.01); B29C 33/76 (2006.01); B22F 3/105 (2006.01); B22F 5/00 (2006.01); B29C 33/38 (2006.01); B29C 45/26 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/04 (2013.01); B22F 3/1055 (2013.01); B22F 5/007 (2013.01); B29C 33/3842 (2013.01); B29C 33/76 (2013.01); B29C 45/2622 (2013.01); B29C 45/7312 (2013.01); B29C 2033/042 (2013.01); B29K 2067/003 (2013.01); B29K 2105/258 (2013.01); B29L 2031/7158 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

There is provided a member of a mold stack (), the member comprising: a member body () defining a member molding surface for defining, in use, a portion of a molding cavity for molding a molded article, a member cooling circuit () having a plurality of member cooling channels (), the plurality of member cooling channels () being coupled in parallel to a source of cooling fluid, the member cooling circuit () being fully encapsulated within the member body ().

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