The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

May. 09, 2013
Applicant:

Schroff Gmbh, Straubenhardt, DE;

Inventors:

Adam Pawlowski, Waldbronn, DE;

Paul Rutherford, Karlsruhe, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H05K 7/1404 (2013.01); H05K 7/20545 (2013.01); Y10T 403/7062 (2015.01); Y10T 403/7066 (2015.01); Y10T 403/7067 (2015.01);
Abstract

A device for retaining a printed circuit board module in a mounting groove of a cold plate, the device comprising an elongated housing made of metal, which has a cross-section in the shape of a horizontal U. A pressure piece made of metal is mounted in the housing so as to be displaceable transversely relative to the rotational axis of the housing and comprises a flat clamping surface on the front side. A rotary cylinder can be rotatably mounted in the housing so as to be transversely displaceable relative to the rotational axis. During a rotation, eccentric guide elements can be used to effect a forward displacement of the rotary cylinder. The pressure piece follows the displacement of the rotary cylinder and slides outward. The waste heat of the printed circuit board module is transported via the housing and the pressure piece to the cold plate.


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