The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Jan. 31, 2014
Applicant:
Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventors:
Nozomu Hikino, Osaka, JP;
Hiroyuki Takebe, Osaka, JP;
Assignee:
Sharp Kabushiki Kaisha, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/00 (2006.01); H01Q 1/24 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); H04M 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); B29K 55/02 (2006.01); B29K 69/00 (2006.01); B29L 9/00 (2006.01); B29L 31/34 (2006.01); B29C 45/00 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); B29C 45/14 (2013.01); B29C 45/16 (2013.01); B29C 45/1671 (2013.01); H01Q 1/243 (2013.01); H04M 1/0202 (2013.01); H04M 1/0249 (2013.01); H05K 1/0284 (2013.01); H05K 1/032 (2013.01); H05K 1/119 (2013.01); H05K 3/36 (2013.01); B29C 2045/0079 (2013.01); B29C 2045/1687 (2013.01); B29K 2055/02 (2013.01); B29K 2069/00 (2013.01); B29L 2009/00 (2013.01); B29L 2031/3456 (2013.01); B29L 2031/3481 (2013.01); H05K 1/165 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/1322 (2013.01); H05K 2203/1476 (2013.01);
Abstract
A first resin layer () has: a covered region which is covered by a second resin layer () and an exposed region (); a contact part () which is provided in the exposed region (); and a bend part () which is provided between (a) a boundary between the covered region and the exposed region () and (b) the contact part ().
Hikino, Nozomu. (2017). Structure, wireless communication device and method for manufacturing structure (U.S. Patent No. 9736944). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9736944
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile