The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Sep. 09, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Suk Hyeon Cho, Suwon-si, KR;
Yong Ho Baek, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Yoong Oh, Suwon-si, KR;
Young Kuk Ko, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0271 (2013.01); H05K 3/007 (2013.01); H05K 3/422 (2013.01); H05K 3/4605 (2013.01); H05K 3/4608 (2013.01); H05K 3/4682 (2013.01); H05K 2201/09827 (2013.01);
Abstract
A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.