The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Oct. 05, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Suk Hyeon Cho, Suwon-si, KR;
Yoong Oh, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
Yong Ho Baek, Suwon-si, KR;
Young Kuk Ko, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/038 (2013.01); H05K 1/115 (2013.01); H05K 3/4605 (2013.01); H05K 1/181 (2013.01); H05K 3/002 (2013.01); H05K 3/0029 (2013.01); H05K 3/0047 (2013.01); H05K 3/0052 (2013.01); H05K 3/429 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10674 (2013.01);
Abstract
There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.