The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

May. 24, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yoshio Koyanagi, Kanagawa, JP;

Koichi Yamamoto, Kanagawa, JP;

Takanori Hirobe, Ishikawa, JP;

Hiroyuki Uejima, Ishikawa, JP;

Kenichiro Tabata, Oita, JP;

Shuichiro Yamaguchi, Oita, JP;

Munenori Fujimura, Oita, JP;

Akio Hidaka, Fukuoka, JP;

Takumi Naruse, Miyazaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 7/02 (2016.01); H02J 7/00 (2006.01); H05K 7/20 (2006.01); H04B 5/00 (2006.01); H02J 5/00 (2016.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H02J 7/025 (2013.01); H02J 5/005 (2013.01); H02J 7/007 (2013.01); H02J 7/0052 (2013.01); H04B 5/0037 (2013.01); H04B 5/0081 (2013.01); H05K 7/20509 (2013.01); G06F 1/203 (2013.01); H04M 2250/04 (2013.01);
Abstract

A mobile terminal is provided with a housing, a circuit substrate, a secondary-side non-contact charging module, and a heat dissipating sheet. The circuit substrate comprises a substrate, an electronic component that is mounted to the substrate, and a shield case that covers the electronic component. The heat dissipation sheet is in contact with the shield case.


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