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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9735431 B1

PDFFull Text
Date of Patent:
Aug. 15, 2017

Filed:

Oct. 15, 2014

Reinforced current collecting substrate assemblies for electrochemical cells

Applicant:

Nexeon Limited, Abingdon, GB;

Inventors:

Marie Kerlau, Saratoga, CA (US);

Madhuri Thakur, Fremont, CA (US);

Assignee:

Nexeon Limited, , GB;

Attorney:

Kwan & Olynick LLP

Primary Examiner:

Patrick Ryan

Assistant Examiner:

Ben Lewis

Int. Cl.
CPC ...
H01M 2/26 (2006.01); H01M 4/70 (2006.01); H01M 4/66 (2006.01); H01M 4/13 (2010.01); H01M 4/36 (2006.01); H01M 4/38 (2006.01); H01M 4/587 (2010.01); H01M 4/62 (2006.01); H01M 4/64 (2006.01); H01M 4/04 (2006.01); H01M 4/02 (2006.01); H01M 4/1395 (2010.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 4/70 (2013.01); H01M 4/045 (2013.01); H01M 4/13 (2013.01); H01M 4/364 (2013.01); H01M 4/38 (2013.01); H01M 4/587 (2013.01); H01M 4/626 (2013.01); H01M 4/64 (2013.01); H01M 4/661 (2013.01); H01M 4/667 (2013.01); H01M 4/668 (2013.01); H01M 4/0404 (2013.01); H01M 4/1395 (2013.01); H01M 4/625 (2013.01); H01M 10/052 (2013.01); H01M 2004/021 (2013.01); H01M 2004/027 (2013.01);
Abstract

Provided is a current collecting assembly for use in an electrochemical cell. In some embodiments, the current collecting assembly comprises a current collecting substrate having a first side defining a first surface, and a second side defining a second surface. Each of the first and second surfaces defines a surface area. The current collecting assembly further comprises a first assembly of reinforcing structures disposed on and attached to the first side of the current collecting substrate. The current collecting substrate comprises a conductive material. The first assembly of reinforcing structures comprises a first set of reinforcing structures. The first set of reinforcing structures comprises a first polymer material. The first assembly of reinforcing structures mechanically reinforces the current collecting substrate.

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