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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9735340 B1

PDFFull Text
Date of Patent:
Aug. 15, 2017

Filed:

Sep. 25, 2013

Method of manufacturing an electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Inventors:

Hidekazu Oishibashi, Nagaokakyo, JP;

Yuichiro Nagamine, Nagaokakyo, JP;

Takeo Sato, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01L 41/107 (2006.01); H01L 41/23 (2013.01); H01L 41/09 (2006.01); H01L 41/293 (2013.01); H01L 21/52 (2006.01); H01L 23/08 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H03H 9/10 (2006.01); H01L 41/22 (2013.01);
U.S. Cl.
CPC ...
H01L 41/107 (2013.01); H01L 21/50 (2013.01); H01L 21/52 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 24/94 (2013.01); H01L 41/09 (2013.01); H01L 41/22 (2013.01); H01L 41/23 (2013.01); H01L 41/293 (2013.01); H03H 9/1021 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/42 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49169 (2015.01); Y10T 156/1062 (2015.01);
Abstract

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

Find Patent Forward Citations

Oishibashi, Hidekazu. (2017). Method of manufacturing an electronic component (U.S. Patent No. 9735340). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9735340

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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