The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Sep. 25, 2013
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/107 (2006.01); H01L 41/23 (2013.01); H01L 41/09 (2006.01); H01L 41/293 (2013.01); H01L 21/52 (2006.01); H01L 23/08 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H03H 9/10 (2006.01); H01L 41/22 (2013.01);
U.S. Cl.
CPC ...
H01L 41/107 (2013.01); H01L 21/50 (2013.01); H01L 21/52 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 24/94 (2013.01); H01L 41/09 (2013.01); H01L 41/22 (2013.01); H01L 41/23 (2013.01); H01L 41/293 (2013.01); H03H 9/1021 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/42 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49169 (2015.01); Y10T 156/1062 (2015.01);
Abstract
A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.