The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Sep. 21, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ning Li, White Plains, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

William T. Spratt, Ossining, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/64 (2006.01); H01S 5/026 (2006.01); H01L 31/0232 (2014.01); H01L 31/173 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 31/18 (2006.01); B01L 3/00 (2006.01); H01L 31/12 (2006.01); H01L 25/16 (2006.01); H01L 21/02 (2006.01); H01L 27/15 (2006.01); H01L 27/144 (2006.01); H01L 21/365 (2006.01); H01L 21/44 (2006.01); H01L 21/465 (2006.01); C12Q 1/68 (2006.01);
U.S. Cl.
CPC ...
H01L 31/173 (2013.01); B01L 3/5027 (2013.01); B01L 3/502707 (2013.01); G01N 21/645 (2013.01); H01L 21/02392 (2013.01); H01L 21/02395 (2013.01); H01L 25/167 (2013.01); H01L 27/1443 (2013.01); H01L 27/15 (2013.01); H01L 31/02327 (2013.01); H01L 31/125 (2013.01); H01L 31/184 (2013.01); H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01S 5/0262 (2013.01); H01S 5/0264 (2013.01); C12Q 1/6872 (2013.01); G01N 2021/6471 (2013.01);
Abstract

After sequentially forming a first multilayer structure comprising a first set of semiconductor layers suitable for formation of a photodetector, an etch stop layer and a second multilayer structure comprising a second set of semiconductor layers suitable for formation of a light source over a substrate, the second multilayer structure is patterned to form a light source in a first region of the substrate. A first trench is then formed extending through the etch stop layer and the first multilayer structure to separate the first multilayer structure into a first part located underneath the light source and a second part that defines a photodetector located in a second region of the substrate. Next, an interlevel dielectric (ILD) layer is formed over the light source, the photodetector and the substrate. A second trench that defines a microfluidic channel is formed within the ILD layer and above the photodetector.


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