The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Nov. 23, 2011
Applicants:

Donald Herr, Lancaster, PA (US);

Brian A. Harkins, Dover, PA (US);

Inventors:

Donald Herr, Lancaster, PA (US);

Brian A. Harkins, Dover, PA (US);

Assignee:

Adhesives Research, Inc., Glen Rock, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); H01L 31/05 (2014.01); C09J 9/02 (2006.01); H01L 31/0224 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0512 (2013.01); C09J 7/0264 (2013.01); C09J 7/0292 (2013.01); C09J 9/02 (2013.01); H01L 31/022425 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C09J 2201/602 (2013.01); C09J 2203/322 (2013.01); C09J 2205/102 (2013.01); C09J 2400/163 (2013.01); C09J 2433/00 (2013.01); Y02E 10/50 (2013.01); Y10T 428/252 (2015.01); Y10T 428/256 (2015.01); Y10T 428/287 (2015.01); Y10T 428/2852 (2015.01); Y10T 428/2857 (2015.01); Y10T 428/2874 (2015.01); Y10T 428/2887 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/2896 (2015.01); Y10T 442/10 (2015.04);
Abstract

A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.


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