The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Aug. 04, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Christian Lavoie, Ossining, NY (US);

Zhengwen Li, Danbury, CT (US);

Ahmet S. Ozcan, Pleasantville, NY (US);

Filippos Papadatos, Austin, TX (US);

Chengwen Pei, Danbury, CT (US);

Jian Yu, Pflugerville, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 29/49 (2006.01); H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 23/535 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7833 (2013.01); H01L 21/0217 (2013.01); H01L 21/02211 (2013.01); H01L 21/02274 (2013.01); H01L 21/28518 (2013.01); H01L 21/31116 (2013.01); H01L 21/321 (2013.01); H01L 21/32053 (2013.01); H01L 21/32133 (2013.01); H01L 21/76802 (2013.01); H01L 21/76805 (2013.01); H01L 21/76829 (2013.01); H01L 23/535 (2013.01); H01L 29/1054 (2013.01); H01L 29/45 (2013.01); H01L 29/456 (2013.01); H01L 29/458 (2013.01); H01L 29/4975 (2013.01); H01L 29/665 (2013.01); H01L 29/6659 (2013.01); H01L 29/66545 (2013.01); H01L 29/7843 (2013.01); H01L 29/7845 (2013.01); H01L 29/7849 (2013.01);
Abstract

A semiconductor device is provided that includes a gate structure on a channel region of a substrate. A source region and a drain region are present on opposing sides of the channel region. A first metal semiconductor alloy is present on an upper surface of at least one of the source and drain regions. The first metal semiconductor alloy extends to a sidewall of the gate structure. A dielectric layer is present over the gate structure and the first metal semiconductor alloy. An opening is present through the dielectric layer to a portion of the first metal semiconductor alloy that is separated from the gate structure. A second metal semiconductor alloy is present in the opening, is in direct contact with the first metal semiconductor alloy, and has an upper surface that is vertically offset and is located above the upper surface of the first metal semiconductor alloy.


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