The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Sep. 12, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Toshinari Hirai, Tokyo, JP;
Tetsujiro Tsunoda, Tokyo, JP;
Toru Ichimura, Tokyo, JP;
Masanori Yamamoto, Tokyo, JP;
Hiroshi Fujita, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape of the power module; and a pair of terminals disposed on the sealant, in both ends of the sealant in a width direction of the power module in an upright manner. The pair of terminals are spaced from each other by a distance greater than the width of a film capacitor being a first electronic component mounted on the bottom surface of a control substrate being a circuit substrate coupled to tips of the pair of terminals. The pair of terminals are longer in a height direction than the film capacitor.