The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Sep. 08, 2016
Infineon Technologies Ag, Neubiberg, DE;
Jens Krugmann, Paderborn, DE;
Christoph Messelke, Arnsberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A power semiconductor module includes a substrate having a first side for being arranged to face a heat sink and for being thermally conductively connected to the heat sink, a power semiconductor component arranged on an opposing second side of the substrate, and an electrically insulating housing defining a cavity in which the substrate and the power semiconductor component are accommodated. The housing includes a frame which surrounds the substrate in a frame-like manner, and a hood for being fastened to the heat sink by way of fastening means. The hood includes a pressing die for making contact with the substrate so as to pre-stress the substrate elastically against the heat sink by means of the hood and the pressing die at least when the power semiconductor module is fastened on the heat sink. The frame accommodates the substrate in an interlocking manner and/or is fastened to the substrate.