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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9735056 B1

PDFFull Text
Date of Patent:
Aug. 15, 2017

Filed:

Oct. 26, 2015

Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage

Applicant:

Fuji Xerox Co., Ltd., Tokyo, JP;

Inventors:

Mutsuya Takahashi, Ebina, JP;

Shuichi Yamada, Ebina, JP;

Michiaki Murata, Ebina, JP;

Assignee:

FUJI XEROX CO., LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Thanh T Nguyen

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3043 (2013.01); H01L 21/3065 (2013.01); H01L 21/30655 (2013.01); H01L 21/6836 (2013.01); H01L 21/304 (2013.01); H01L 33/0095 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

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Takahashi, Mutsuya. (2017). Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage (U.S. Patent No. 9735056). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9735056

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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