The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jul. 16, 2014
Applicant:

Alps Electric Co., Ltd., Tokyo, JP;

Inventors:

Ryo Iwasaki, Miyagi-ken, JP;

Shoji Kai, Miyagi-ken, JP;

Shunji Kuwana, Miyagi-ken, JP;

Shiro Ikeda, Miyagi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/10 (2006.01); H05K 3/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/10 (2013.01); H05K 3/0052 (2013.01); H01L 23/552 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/0989 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0594 (2013.01);
Abstract

An electronic circuit unit includes a circuit substrate having a rectangular shape and is obtained by cutting an integral substrate along a vertical cut line and a horizontal cut line to be separated; a copper foil land soldered to components; and a substrate outer edge, which is formed by cutting, of two sides orthogonal to each other. The copper foil land and the substrate outer edge are positioned in the vicinity of a corner of the circuit substrate. Solder resist is provided around the copper foil land. A plurality of substrate exposure portions without the solder resist is provided in the vicinity of the substrate outer edge.


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