The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Aug. 19, 2011
Applicants:

Gang Liu, Natick, MA (US);

David Michael, Wayland, MA (US);

Inventors:

Gang Liu, Natick, MA (US);

David Michael, Wayland, MA (US);

Assignee:

Cognex Corporation, Natick, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 31/02 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); G03F 9/7092 (2013.01); H01L 31/02 (2013.01);
Abstract

Described are computer-based methods and apparatuses, including computer program products, for aligning a wafer for fabrication. A first image of a first portion of a wafer is received from a first image capturing device. A second image of a second portion of the wafer is received from a second image capturing device, wherein an image capturing device transform defines a first relationship between the first image capturing device and the second image capturing device. A first fiducial pattern in the first image and a second fiducial pattern in the second image are identified, based on the image capturing device transform, a fiducial transform that defines, based on a specification for the wafer, a second relationship between the first fiducial pattern and the second fiducial pattern, and a threshold value configured to identify low contrast fiducial patterns on wafers. An alignment of the wafer is determined based on the identified first and second fiducial patterns.


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Liu, Gang. (2017). System and method for aligning a wafer for fabrication (U.S. Patent No. 9735036). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9735036

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