The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jan. 15, 2015
Applicant:

Renesas Electronics Corporation, Kanagawa, JP;

Inventors:

Yoshinori Murakami, Kanagawa, JP;

Hitoshi Fukuma, Kanagawa, JP;

Taku Kanaoka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); C25D 3/48 (2006.01); C25D 7/12 (2006.01); C25D 5/10 (2006.01); C25D 5/18 (2006.01); C25D 17/00 (2006.01); H01L 23/00 (2006.01); C25D 5/16 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C25D 3/48 (2013.01); C25D 5/10 (2013.01); C25D 5/18 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 24/11 (2013.01); H01L 24/742 (2013.01); C25D 5/16 (2013.01); C25D 21/10 (2013.01); H01L 24/13 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13144 (2013.01);
Abstract

A false report on appearance inspection of a semiconductor device is prevented by suppressing variation in surface state of an electrodeposited gold electrode. In formation of an electrodeposited gold electrode, an electrodeposited gold electrode comprised of a plurality of electrodeposited gold layers in the stack is formed by alternately repeating a step of performing energization between an anode electrode and a cathode electrode provided in a treatment cup of a plating apparatus to cause crystal growth of an electrodeposited gold layer (energization ON), and a step of performing no energization between the anode electrode and the cathode electrode (energization OFF). Consequently, even if aging variation occurs in composition of the plating solution, variation in surface state of the electrodeposited gold electrode is suppressed, and a surface state with a surface roughness of, for example, about 0.025 rad can be maintained.


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