The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Feb. 16, 2014
Applicant:

Tpk Touch Solutions Inc., Taipei, TW;

Inventors:

Jun-Yao Huang, Miaoli, TW;

Po-Pin Hung, Kinmen, TW;

Hsiang-Yu Teng, Keelung, TW;

Chun-Chi Lin, Yunlin, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 3/044 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1692 (2013.01); G06F 3/044 (2013.01); H05K 3/107 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A touch panel having a cover plate, a sensor electrode layer, an insulating layer and a jumper layer is provided. The sensor electrode layer has first axis electrodes, second axis electrodes, bonding pads and first periphery traces. Each first axis electrode has first electrode blocks that are electrically connected to each other. Each second axis electrode has second electrode blocks that are electrically isolated from each other. The bonding pads are disposed on the periphery region of the cover plate. The first periphery traces are electrically connected to the bonding pads and the first axis electrodes or the second axis electrodes respectively. The insulating layer has first via holes and second via holes. The jumper layer has jumper traces and second periphery traces, wherein the second periphery traces are electrically connected to the first axis electrodes or the second axis electrodes through the first via holes.


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