Infrared proximity sensor package with improved crosstalk isolation

Abstract

Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising sidewalls, a first recess, a second recess, a partitioning divider disposed between the first and second recesses, and an overlying shield comprising an infrared-absorbing material. The transmitter die is positioned in the first recess, and the receiver die is positioned within the second recess. The partitioning divider comprises liquid crystal polymer (LCP) such that the partitioning divider and the infrared-absorbing material of the shield cooperate together to substantially attenuate and absorb undesired infrared light that might otherwise become internally-reflected within the housing or incident upon the receiver as a false proximity or object detection signal.