The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Aug. 27, 2012
Applicants:

Xiaofeng Lei, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Wei LI, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Inventors:

Xiaofeng Lei, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Wei Li, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/02 (2006.01); G01R 33/00 (2006.01); G01R 33/028 (2006.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0206 (2013.01); G01R 33/0005 (2013.01); G01R 33/0052 (2013.01); G01R 33/093 (2013.01); G01R 33/098 (2013.01); G01R 33/028 (2013.01); G01R 33/09 (2013.01); G01R 33/096 (2013.01);
Abstract

The present invention discloses a triaxial magnetoresistive sensor. It comprises a substrate integrated with a biaxial magnetic field sensor, a Z-axis sensor that has a sensing direction along Z-axis perpendicular to the two axes of the biaxial magnetic field sensor, and an ASIC. The biaxial magnetic field sensor comprises an X-axis bridge sensor and a Y-axis bridge sensor. The Z-axis sensor and the two-axis sensor are electrically interconnected with the ASIC. A single-chip implementation of the triaxial magnetic field sensor comprises a substrate, onto which a triaxial magnetic field sensor and an ASIC are stacked. The triaxial magnetic field sensor comprises an X-axis bridge sensor, a Y-axis bridge sensor, and a Z-axis bridge sensor. The above design provides a highly integrated sensor with high sensitivity, low power consumption, good linearity, wide dynamic range, excellent thermal stability, and low magnetic noise.


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