The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Oct. 04, 2012
Applicants:

Robert Bosch Gmbh, Stuttgart, DE;

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventor:

Karsten Thoelmann, Moeglingen, DE;

Assignees:

Robert Bosch GmbH, Stuttgart, DE;

Samsung SDI Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/48 (2006.01); G01R 31/36 (2006.01); H04Q 9/00 (2006.01); H01M 10/42 (2006.01); B60L 3/00 (2006.01); B60L 11/18 (2006.01); H02J 7/00 (2006.01); H02J 13/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/3606 (2013.01); B60L 3/0046 (2013.01); B60L 11/1864 (2013.01); H01M 10/4207 (2013.01); H01M 10/4257 (2013.01); H01M 10/482 (2013.01); H02J 7/0021 (2013.01); H02J 13/0079 (2013.01); H04Q 9/00 (2013.01); B60L 2240/545 (2013.01); B60L 2240/547 (2013.01); B60L 2240/549 (2013.01); B60L 2270/147 (2013.01); G01R 31/3658 (2013.01); H01M 2010/4271 (2013.01); H01M 2220/20 (2013.01); H04Q 2209/10 (2013.01); H04Q 2209/30 (2013.01); Y02T 10/7011 (2013.01); Y02T 10/7055 (2013.01); Y02T 10/7061 (2013.01); Y02T 90/16 (2013.01);
Abstract

A battery management unit includes a plurality of monitoring IC chips each configured to detect at least one operating parameter of at least one battery cell or battery module, which has a predetermined number of battery cells and is connected to a first bus. The battery management unit further includes a control unit and a basis monitoring IC chip which is likewise connected to the first bus and is configured to communicate with each of the monitoring IC chips via the first bus. The basis monitoring IC chip and the control unit are connected to a second bus and are configured to communicate with each other via the second bus. The basis monitoring IC chip and the control unit are arranged on a common circuit board.


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