The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Oct. 05, 2016
Applicant:

Translarity, Inc., Fremont, CA (US);

Inventors:

Douglas A. Preston, McMinnville, OR (US);

Morgan T. Johnson, Beaverton, OR (US);

Assignee:

Translarity, Inc., Fremont, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); H01L 21/66 (2006.01); G01R 3/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06738 (2013.01); G01R 1/06744 (2013.01); G01R 1/07378 (2013.01); G01R 31/2886 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); G01R 3/00 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.


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