The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Jan. 24, 2011
Applicants:
Marcel Broekaart, Theys, FR;
Arnaud Castex, Grenoble, FR;
Laurent Marinier, Lumbin, FR;
Inventors:
Assignee:
Sony Semiconductors Solutions Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 5/28 (2006.01); G01B 17/06 (2006.01); G01B 21/32 (2006.01); G01N 29/06 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G01B 17/06 (2013.01); G01B 21/32 (2013.01); G01N 29/0681 (2013.01); G01N 2291/2697 (2013.01); G03F 7/70616 (2013.01); G03F 7/70633 (2013.01);
Abstract
A method and device for evaluating inhomogeneous deformations in a first wafer bonded by molecular adhesion to a second wafer. This evaluation method includes the steps of making at least one reading of a plurality of measurement points, the reading corresponding to a surface profile of the first wafer along a predefined direction and over a predefined length, computing a second derivative from the measurement points of the surface profile and evaluating a level of inhomogeneous deformations in the first wafer according to the second derivative.