The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Jul. 24, 2013
Applicant:
Uacj Corporation, Chiyoda-ku, Tokyo, JP;
Inventors:
Masakazu Seki, Chiyoda-ku, JP;
Satoshi Suzuki, Chiyoda-ku, JP;
Assignee:
UACJ CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); B65D 23/08 (2006.01); B65D 23/02 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
C22C 21/00 (2013.01); B32B 15/01 (2013.01); B32B 15/016 (2013.01); B65D 23/02 (2013.01); B65D 23/0807 (2013.01); C22F 1/04 (2013.01); H01M 2/026 (2013.01); H01M 2/0275 (2013.01); H01M 2/0285 (2013.01); H01M 2/0287 (2013.01); H01M 2/0272 (2013.01); H01M 2/0292 (2013.01); H01M 2002/0297 (2013.01); Y10T 428/1359 (2015.01);
Abstract
An aluminum alloy foil having superior formability is provided. An aluminum alloy foil, including 0.8 to 2.0 mass % of Fe, 0.05 to 0.2 mass % of Si, and 0.0025 to 0.5 mass % of Cu, with the rest consisting of Al and unavoidable impurities, wherein the aluminum alloy foil has an average crystal grain size of 20 μm or less, and a number of intermetallic compounds existing in the aluminum alloy foil, the intermetallic compounds having a circle equivalent diameter of 1.0 to 5.0 μm, is 1.0×10grains/mmor more, is provided.