The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Dec. 05, 2014
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Shuji Kaneda, Okayama, JP;

Hidefumi Fujita, Okayama, JP;

Daisuke Itoh, Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/106 (2014.01); C09D 5/24 (2006.01); C09D 7/12 (2006.01); C09D 129/14 (2006.01); C09D 139/06 (2006.01); C08K 9/04 (2006.01); C08K 9/10 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C09D 7/12 (2013.01); C09D 7/1225 (2013.01); C09D 11/106 (2013.01); C09D 11/52 (2013.01); C09D 129/14 (2013.01); C09D 139/06 (2013.01); H01B 1/22 (2013.01); H05K 1/097 (2013.01); H05K 3/1216 (2013.01); H05K 3/1283 (2013.01); C08K 9/04 (2013.01); C08K 2201/001 (2013.01); C08K 2201/003 (2013.01);
Abstract

After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 μm, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.


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