The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Nov. 10, 2014
Applicant:
Idemitsu Kosan Co., Ltd., Chiyoda-ku, JP;
Inventors:
Assignee:
IDEMITSU KOSAN CO., LTD., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08G 64/06 (2006.01); C08K 5/42 (2006.01); C08L 69/00 (2006.01); C08L 71/02 (2006.01); C08K 5/55 (2006.01); F21V 8/00 (2006.01); B29C 45/00 (2006.01); B29K 69/00 (2006.01);
U.S. Cl.
CPC ...
C08G 64/06 (2013.01); C08K 5/42 (2013.01); C08K 5/55 (2013.01); C08L 69/00 (2013.01); C08L 71/02 (2013.01); G02B 6/0065 (2013.01); B29C 45/0001 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0026 (2013.01);
Abstract
Provided is a polycarbonate resin molding material, including an aromatic polycarbonate resin (A), in which the polycarbonate resin molding material has: a content of o-hydroxyacetophenone measured by a predetermined method (1) of 1 ppm by mass or less; and a YI value measured by a predetermined method (2) of 1.21 or less.