The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Aug. 24, 2015
Applicant:

Korea Institute of Industrial Technology, Cheonan, KR;

Inventors:

Hyun-Aee Chun, Seongnam, KR;

Sung-Hwan Park, Gunpo, KR;

Yun-Ju Kim, Seoul, KR;

Su-Jin Park, Ansan, KR;

Sook-Yeon Park, Gunpo, KR;

Sang-Yong Tak, Busan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/06 (2006.01); C08G 59/02 (2006.01); C07F 7/18 (2006.01); C09J 163/00 (2006.01); C07D 303/12 (2006.01); C07D 303/36 (2006.01); C07D 405/06 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); C08G 59/30 (2006.01);
U.S. Cl.
CPC ...
C08G 59/02 (2013.01); C07D 303/12 (2013.01); C07D 303/36 (2013.01); C07D 405/06 (2013.01); C07F 7/1836 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C08G 59/06 (2013.01); C08G 59/306 (2013.01); Y10T 428/239 (2015.01);
Abstract

Provided are alkoxysilylated epoxy compounds, a composite of which exhibits good heat resistance properties, low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy without requiring separate coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including an epoxy group and at least one alkoxysilyl group of an S1 substituent selected from Formulae S11 to S15 or an S2 substituent selected from Formulae S21 to S25; a method for preparing the same by epoxy ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition, are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved.


Find Patent Forward Citations

Loading…