The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Dec. 24, 2013
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Hyo Ju Kim, Daejeon, KR;
Choong Hoon Lee, Daejeon, KR;
Sung Ho Choi, Daejeon, KR;
Ji Yoon Woo, Daejeon, KR;
Jin Sam Gong, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 151/06 (2006.01); C08F 210/16 (2006.01); C08L 51/00 (2006.01); C08K 5/132 (2006.01); C08K 5/134 (2006.01); C08K 5/52 (2006.01); H01L 31/048 (2014.01); C08J 5/18 (2006.01); H01L 31/18 (2006.01); H01L 31/049 (2014.01); C08L 23/08 (2006.01); C08K 5/544 (2006.01); C08L 23/00 (2006.01); C08F 255/02 (2006.01); C08F 8/42 (2006.01); C08L 51/06 (2006.01); H01L 23/29 (2006.01); C08K 5/14 (2006.01); C08K 5/5425 (2006.01); C09D 143/04 (2006.01); C09D 151/06 (2006.01);
U.S. Cl.
CPC ...
C08F 210/16 (2013.01); C08F 8/42 (2013.01); C08F 255/02 (2013.01); C08J 5/18 (2013.01); C08K 5/132 (2013.01); C08K 5/1345 (2013.01); C08K 5/14 (2013.01); C08K 5/52 (2013.01); C08K 5/544 (2013.01); C08K 5/5425 (2013.01); C08L 23/00 (2013.01); C08L 23/08 (2013.01); C08L 23/0815 (2013.01); C08L 51/003 (2013.01); C08L 51/06 (2013.01); C09D 143/04 (2013.01); C09D 151/06 (2013.01); C09J 151/06 (2013.01); H01L 23/29 (2013.01); H01L 23/296 (2013.01); H01L 31/048 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 31/18 (2013.01); C08J 2323/08 (2013.01); C08J 2451/06 (2013.01); C08L 2203/204 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); H01L 2924/0002 (2013.01); Y02E 10/20 (2013.01);
Abstract
An encapsulant film and an optoelectronic device are provided. The encapsulant film having improved thermal resistance, and excellent adhesion, especially, long-term adhesive properties, to a front substrate and a back sheet can be provided. Also, the optoelectronic device capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated by the encapsulant film can be provided.