The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Sep. 22, 2016
Applicant:

Thales, Courbevoie, FR;

Inventors:

Fabien Filhol, Valence, FR;

Pierre-Olivier Lefort, Valence, FR;

Bertrand Leverrier, Montelier, FR;

Régis Quer, Saint Peray, FR;

Bernard Chaumet, Chatellerault, FR;

Assignee:

THALES, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 3/00 (2006.01); B81C 1/00 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0016 (2013.01); B81B 7/0051 (2013.01); B81C 1/00269 (2013.01); B81C 3/001 (2013.01); H01L 23/10 (2013.01); B81C 2201/019 (2013.01);
Abstract

A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.


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