The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Sep. 17, 2015
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventors:

Thomas B. Brust, Webster, NY (US);

Anne Troxell Wyand, Victor, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/21 (2006.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/102 (2014.01); C09D 11/30 (2014.01);
U.S. Cl.
CPC ...
B41J 2/2107 (2013.01); C09D 11/101 (2013.01); C09D 11/102 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01);
Abstract

A method for forming an ink jet image on a substrate includes ink jetting an ink jettable and UV-curable composition onto the substrate in an imagewise fashion to form an ink jetted image on the substrate. The ink jettable and UV-curable composition includes: a reactive polymer comprising: (a1) or (a2) recurring units comprising pendant metal complexing water-solubilizing groups, (b) at least 5 mol % of recurring units having a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally (c) at least 1 mol % of recurring units comprising a pendant amide, hydroxyl, or lactam group, or a pendant precursor moiety for the pendant amide, hydroxyl, or lactam group. The ink jetted image is cured to form a UV-cured ink jet image on the substrate. The ink jettable and UV-curable composition can also include metal nanoparticles or reducible metal ions that can serve as catalytic sites for electroless plating.


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