The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Jun. 18, 2014
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Inventors:

Guang Yang, Beijing, CN;

Peng Shen, Beijing, CN;

Yanming Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 27/12 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0017 (2013.01); H01L 27/124 (2013.01); H01L 27/1214 (2013.01); H01L 27/1218 (2013.01); H01L 27/1248 (2013.01); H01L 27/1288 (2013.01); H05K 1/0296 (2013.01); H05K 3/0073 (2013.01); H05K 3/46 (2013.01);
Abstract

A display panel motherboard and a manufacturing method thereof are provided. The display panel motherboard comprises display panel regions (Q) spaced apart from each other and precut regions (Q) adjacent to the display panel regions. The manufacturing method comprises forming an electrical insulating layer (); and removing at least portions of the electrical insulating layer provided on the precut regions (Q). The method avoids the problem of other patterns offset on the display panel motherboard caused by the larger internal stress within the electrical insulating layer.


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