The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Nov. 29, 2011
Applicants:
Zhongyao Yu, Beijing, CN;
Xia Zhang, Beijing, CN;
Inventors:
Zhongyao Yu, Beijing, CN;
Xia Zhang, Beijing, CN;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/96 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/46 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24135 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/12042 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09509 (2013.01);
Abstract
An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip.